Avicena, based in Sunnyvale, CA, develops LightBundle, a microLED-based ultra-low power, high-density optical interconnect architecture. Its technology uses arrays of GaN microLEDs integrated onto CMOS ICs, coupled into multi-fiber cables and matching silicon detectors to deliver high bandwidth density, energy efficiency, reliability and lower cost versus laser-based solutions. The company targets AI datacenters, disaggregated memory fabrics, AI/ML, HPC, sensors, 5G and aerospace applications and says the approach leverages the large display ecosystem. Avicena positions its product to enable disaggregation of compute and memory and to grow system throughput while reducing energy impact. It will use new funding to scale its team and ramp its first product into production. Financially, Avicena raised $65M in a Series B, bringing total capital raised to $120M. AvicenaTech develops ultra-low energy optical links based on microLEDs, marketed as its LightBundle I/O solution. LightBundle is built from arrays of GaN micro-emitters that can be integrated onto high-performance CMOS ICs and leverages the microLED display ecosystem for high-volume, low-cost production. The technology is designed to eliminate copper-link bottlenecks in power, latency, reach, and bandwidth density and to enable higher-performing architectures in HPC, AI/ML, cloud computing, next-generation cellular radio, remote sensing, and aerospace. Avicena positions its products for chip-to-chip interconnects, memory disaggregation, and medium-reach links across datacenter and wireless use cases. The company is privately held and located in Mountain View, CA, and is led by founder and CEO Bardia Pezeshki. Avicena says it will use the $25M Series A to scale its team and build initial products for partners and customers.

Total raised

$90M

Funding rounds

2

Latest round

Series B

Latest activity

May 2025