Participated · Series B · Oct 2025

Seattle-based Membrion, led by CEO and founder Greg Newbloom, provides adaptive water-infrastructure solutions built around its proprietary ceramic desalination membranes. The technology is designed to process the toughest industrial waste streams, allowing manufacturers to reclaim usable water and valuable minerals while meeting evolving environmental regulations and climate-driven pressures. Membrion positions its membranes as a reliability tool for future-proofing production facilities against regulatory shifts and supply-chain risks. With the fresh capital, the company plans to scale operations and accelerate product development. Since inception, Membrion has raised a cumulative $43 million. No revenue or customer counts were disclosed in the article, but the company emphasizes industrial adoption and continued R&D as key growth drivers.

Participated · Series B · May 2025

Avicena, based in Sunnyvale, CA, develops LightBundle, a microLED-based ultra-low power, high-density optical interconnect architecture. Its technology uses arrays of GaN microLEDs integrated onto CMOS ICs, coupled into multi-fiber cables and matching silicon detectors to deliver high bandwidth density, energy efficiency, reliability and lower cost versus laser-based solutions. The company targets AI datacenters, disaggregated memory fabrics, AI/ML, HPC, sensors, 5G and aerospace applications and says the approach leverages the large display ecosystem. Avicena positions its product to enable disaggregation of compute and memory and to grow system throughput while reducing energy impact. It will use new funding to scale its team and ramp its first product into production. Financially, Avicena raised $65M in a Series B, bringing total capital raised to $120M. AvicenaTech develops ultra-low energy optical links based on microLEDs, marketed as its LightBundle I/O solution. LightBundle is built from arrays of GaN micro-emitters that can be integrated onto high-performance CMOS ICs and leverages the microLED display ecosystem for high-volume, low-cost production. The technology is designed to eliminate copper-link bottlenecks in power, latency, reach, and bandwidth density and to enable higher-performing architectures in HPC, AI/ML, cloud computing, next-generation cellular radio, remote sensing, and aerospace. Avicena positions its products for chip-to-chip interconnects, memory disaggregation, and medium-reach links across datacenter and wireless use cases. The company is privately held and located in Mountain View, CA, and is led by founder and CEO Bardia Pezeshki. Avicena says it will use the $25M Series A to scale its team and build initial products for partners and customers.

Participated · Series B · Jun 2019

Palo Alto–based Mythic has developed Analog Processing Units (APUs) that collapse compute and memory into a single plane, achieving around 120 TOPS-per-watt—roughly 100 × the energy efficiency of top-tier GPUs—even when moving data. The chips, already in production and validated by the U.S. DoD, major auto OEMs and defense contractors, target four trillion-dollar markets: data centers, automotive, robotics and defense, while also scaling to 1-trillion-parameter large language models. Internal benchmarks show up to 750× more tokens-per-second-per-watt and as much as an 80× cost advantage per million tokens versus NVIDIA’s highest-end GPUs. Beyond standalone APUs, Mythic is commercializing “Starlight” sub-1 W sensing modules that integrate its compute-in-memory technology directly into image sensors for 50× performance gains in low-light scenarios. The company offers a mature CAMP SDK that supports ONNX, PyTorch and TensorFlow and has been rated best-in-class among compute-in-memory peers. Led by former NVIDIA executive Taner Ozcelik, Mythic’s roadmap includes enabling ChatGPT-class models to run locally on handheld devices at roughly 1/100th today’s cost. The recent $125 million raise gives the firm substantial runway to scale manufacturing and expand its product portfolio.

Participated · Series A · Oct 2017

EchoPixel develops True 3D Viewer, an interactive virtual reality software that converts DICOM image data into life‑size, manipulable virtual patient anatomy for diagnosis and surgical planning. The system lets physicians move, turn, dissect and cut open virtual anatomy to interact with images as if they were physical objects. EchoPixel's True 3D is used in clinical and research settings at institutions including UCSF, Stanford, the Cleveland Clinic, the Lahey Clinic and Hershey Medical Center. The company is led by founder and CEO Sergio Aguirre and Executive Chairman Ron Schilling, PhD, and is based in Mountain View, California. EchoPixel closed an $8.5M Series A and plans to use proceeds to expand its commercial, R&D and regulatory organizations. EchoPixel’s core product is a real-time, interactive 3D imaging system that converts CT, MRI and ultrasound scans into manipulable, hologram-like images viewable with 3D glasses and a special display. The system lets doctors virtually examine anatomy from any angle, zoom in on small structures, and 3D print models for planning. Clinical trials reported finding up to 90% more congenital heart defects in newborns while reducing exam time by 40%, and a separate trial cut device sizing time from 40 minutes to 2 minutes. EchoPixel is already FDA-cleared and plans to pursue regulatory approvals in Europe and Asia. The company sells three-year subscriptions to its technology at $25,000 per year. EchoPixel operates from Palo Alto, California and competes with companies such as Surgical Theater and RealView.

Participated · Series C · Sep 2017

Reno Sub-Systems develops technologies for the semiconductor and advanced microelectronic industries, including high-performance RF matching networks, RF power generators and gas delivery systems for nanoscale manufacturing processes. Led by CEO Bob MacKnight, the company supplies equipment and subsystems used in silicon manufacturing. It closed a Series C round to fund continued development and scaling of its technologies. The company intends to use the proceeds to enable silicon manufacturing technology nodes in high-volume production. The article does not disclose operating metrics or revenues. The focus is on advancing tools for nanoscale manufacturing and preparing those technologies for high-volume deployment. Reno Sub-Systems develops high-performance radio frequency (RF) matching networks, RF power generators and gas flow management systems for semiconductor manufacturing. Its enabling technologies aim to enable plasma processing to deep submicron feature sizes and short process times for both planar and 3D device architectures. The company also facilitates “always on” plasma management, fast gas transitions and low-flow management to reduce on-wafer particles, lower cost per transistor and improve film properties. Led by CEO Bob MacKnight, Reno Sub-Systems targets advanced microelectronic circuits and new process regimes. The company recently closed a $14M Series B financing. It plans to use the funds to win more platforms and move into high-volume manufacturing to cover demand. Reno Sub-Systems is a Bedford, Nova Scotia-based company that develops technologies for the semiconductor and advanced micro-electronic industries. Led by CEO David Ferran, the company designs, develops and delivers sub-systems used to control OEM process systems, including vacuum-based chambers for depositing and etching specialty materials in advanced IC fabrication. Its initial sub-system offerings provide RF-power generation and matching, process gas delivery and high-vacuum process control. The company intends to use proceeds from its recently closed venture funding round to bring its technologies to market. Reno maintains a U.S. headquarters in San Diego and technology development centers in New Jersey, California and Nevada. Backers in the round included Intel Capital, Innovacorp and other investors.