Baya Systems develops software-driven system IP and modular fabric for chiplet-ready SoC and multi-die designs to accelerate intelligent compute. Its flagship WeaverPro software enables continuous architecture and micro-architecture refinement from initial specification through post-silicon tuning, with built-in simulation and workload analysis to ensure designs meet KPIs. The WeaveIP portfolio provides advanced transport and system IP that supports custom and standard protocols to maximize throughput while minimizing latency, silicon footprint and power. Baya says it will use proceeds from its Series B to support operational growth and accelerate development and deployment of its technology for AI, automotive and data center infrastructure. The company emphasizes compliance with emerging standards such as Ultra Accelerator Link (UALink™) die-to-die interconnect and aims to serve the emerging chiplet economy as SoCs evolve into system-of-chips models. Early customers include Tenstorrent, which has licensed Baya technology, and the company notes additional partnerships are forthcoming. Baya highlights a leadership team drawn from Apple, AMD, Arm, Intel and Qualcomm, with Jim Keller serving as chairman of the board.

Total raised

$36M

Funding rounds

1

Latest round

Series B

Latest activity

Jan 2025