Participated · Series A · Mar 2026

Kandou AI designs and delivers high-performance connectivity products and interconnect IP for datacenter infrastructure, AI and consumer electronics customers. The company reports over 20 million silicon units shipped using its technology. Recent engineering milestones include tapeout of its next-generation SerDes technology and growing momentum in its retimer product lines. Kandou AI has expanded its global engineering footprint with a new design center in Hyderabad, India, and has added industry veterans to its executive team. With the $225M Series A, the company plans manufacturing ramp-up for its AI connectivity chips and to accelerate its chip and IP portfolio. The company is led by Co-Founder and CEO Srujan Linga and is headquartered in Saint-Sulpice, Switzerland.

Participated · Series B · Jan 2025

Baya Systems develops software-driven system IP and modular fabric for chiplet-ready SoC and multi-die designs to accelerate intelligent compute. Its flagship WeaverPro software enables continuous architecture and micro-architecture refinement from initial specification through post-silicon tuning, with built-in simulation and workload analysis to ensure designs meet KPIs. The WeaveIP portfolio provides advanced transport and system IP that supports custom and standard protocols to maximize throughput while minimizing latency, silicon footprint and power. Baya says it will use proceeds from its Series B to support operational growth and accelerate development and deployment of its technology for AI, automotive and data center infrastructure. The company emphasizes compliance with emerging standards such as Ultra Accelerator Link (UALink™) die-to-die interconnect and aims to serve the emerging chiplet economy as SoCs evolve into system-of-chips models. Early customers include Tenstorrent, which has licensed Baya technology, and the company notes additional partnerships are forthcoming. Baya highlights a leadership team drawn from Apple, AMD, Arm, Intel and Qualcomm, with Jim Keller serving as chairman of the board.

Participated · Series A · Oct 2023

Efabless operates an open-source, community-driven platform for designing, sharing, prototyping and commercializing custom chips. The platform has executed approximately 1,000 designs and 500 tapeouts over the past two years and serves Fortune 100 companies, startups, universities and research institutions. Efabless aims to lower barriers in chip creation and to expand access for designers in markets such as IoT, artificial intelligence and machine learning. The company’s model is extensible to advanced packaging, software and systems, and it is headquartered in Palo Alto, California. The business plans described in the article include continued product development, business development and marketing to grow its community and commercial adoption. Efabless operates a creator community platform for designing, developing, and commercializing integrated circuits, aiming to democratize electronics product creation. The platform supports both open-source ICs via a Google-partnered design-to-prototype solution and proprietary designs through its chipIgnite program. Efabless positions itself to reduce cost and time to market for proof-of-concept chips and to broaden access for chip experts, software and hardware developers across Fortune 100 companies, startups, and academia. The company highlights opportunity in markets like IoT and machine learning where custom silicon can deliver large performance and efficiency gains. Efabless plans to continue expanding its product capabilities and business development efforts, and to extend its model to advanced packaging, software, and systems. The company is headquartered in Palo Alto, California.