Blaize provides a purpose‑built, full‑stack programmable processor architecture and a low‑code/no‑code software platform (Blaize AI Studio and Blaize Picasso SDK) for edge and data‑center AI. Its solutions target automotive, mobility, retail, security, industrial automation, healthcare and other markets, emphasizing low power consumption, minimal latency and high efficiency. The company’s architecture and software aim to enable rapid development and deployment of applications with a highly optimized total cost of ownership. Blaize says current and next‑generation offerings will support computer vision, transformers and multimodal generative AI, and are designed to scale from the edge to the data center. The company has a comprehensive partner ecosystem and more than 200 employees across offices in El Dorado Hills (CA), San Jose (CA), Cary (NC), Hyderabad (India), Leeds and Kings Langley (UK), and Abu Dhabi (UAE). Blaize previously raised $224 million from strategic and financial investors and recently completed a $106 million financing to strengthen its balance sheet and accelerate its roadmap. In December 2023 Blaize announced its intention to go public via a business combination with Nasdaq‑listed BurTech Acquisition Corp. Blaize develops AI System-on-Chips (SoCs) and the Blaize AI Studio end-to-end application lifecycle software platform for edge and automotive computing. Its GSP architecture underpins first-generation edge hardware released in 2020 and a multi-year pipeline of products. The company targets automotive (in-cabin, out-of-vehicle, and autonomous functions), smart retail, smart city/metro and industrial markets. Blaize emphasizes power-efficient performance advantages for electric vehicles and centralized automotive compute, positioning its SoCs to improve efficiency and lower cost. The company will use the $71M Series D to accelerate its product roadmap and develop next-generation hardware and software to meet demand for higher performance, lower power and lower cost AI solutions. Prior to the Series D Blaize had raised US$87M from strategic and venture backers and employs 300+ people with headquarters in El Dorado Hills, California and teams/subsidiaries in Campbell and Cary (US), Hyderabad, Manila and the UK. ThinCI is an Artificial Intelligence computing architecture startup developing computing platforms for the expanding AI/machine learning market. Its core product is the Graph Streaming Processor (GSP) and a Software Development Kit (SDK), a general purpose fully programmable computing architecture. The GSP and SDK are designed to accelerate and optimize machine learning, deep learning, neural networks and computer vision workloads. ThinCI targets deployment across data center servers, edge infrastructure platforms and client platforms, from massive machine learning farms to sensor fusion and advanced neural networks for autonomous driving. The company said it will use proceeds from the Series C to continue to expand operations. ThinCI is led by CEO Dinakar Munagala and has teams in California, Hyderabad, India and the UK. Thinci develops machine-learning technology, including silicon and software, to enable embedded deep learning and vision processing in electronic systems. Led by CEO Dinakar Munagala, the company targets automotive applications such as advanced driver assistance systems and autonomous driving. Its technology can also be integrated into personal electronics and smart home automation systems. Thinci's product focus is on embedding vision processing into vehicle electronics to improve thermal system efficiency and optimize powertrain productivity. The article does not disclose revenue, user metrics, or the financial terms of the investment.

Total raised

$242M

Funding rounds

4

Latest round

Equity

Latest activity

Apr 2024