
DENSO
24777 Denso Drive, Southfield, MI, 48033, United States
Overview
DENSO is a supplier of advanced automotive technology, systems and components for major automakers. They are committed to making the world a better place through their world-first products and technologies.
- Total investments
- 18
- Lead investments
- 6
- Investments · 12mo
- 1
- Active investors
- 8
Sector focus
- Automotive
- Manufacturing
- Product Design
Investment portfolio
- Turing
Participated · Series A · Nov 2025
Turing develops fully autonomous driving technology originating in Japan. The company is scaling its computing infrastructure and commercial operations as it moves toward real-world deployment. In its Series A and extension rounds the company has raised a cumulative ¥27.89 billion (about $174 million), including ¥12.62 billion (about $79 million) in the recent extension. Turing plans to use the new funding to expand compute capacity, strengthen its business organization for deployment, and hire additional staff. The company’s stated goal is to accelerate realization of Japan-developed fully autonomous driving systems.
- Blaize
Participated · Equity · Apr 2024
Blaize provides a purpose‑built, full‑stack programmable processor architecture and a low‑code/no‑code software platform (Blaize AI Studio and Blaize Picasso SDK) for edge and data‑center AI. Its solutions target automotive, mobility, retail, security, industrial automation, healthcare and other markets, emphasizing low power consumption, minimal latency and high efficiency. The company’s architecture and software aim to enable rapid development and deployment of applications with a highly optimized total cost of ownership. Blaize says current and next‑generation offerings will support computer vision, transformers and multimodal generative AI, and are designed to scale from the edge to the data center. The company has a comprehensive partner ecosystem and more than 200 employees across offices in El Dorado Hills (CA), San Jose (CA), Cary (NC), Hyderabad (India), Leeds and Kings Langley (UK), and Abu Dhabi (UAE). Blaize previously raised $224 million from strategic and financial investors and recently completed a $106 million financing to strengthen its balance sheet and accelerate its roadmap. In December 2023 Blaize announced its intention to go public via a business combination with Nasdaq‑listed BurTech Acquisition Corp. Blaize develops AI System-on-Chips (SoCs) and the Blaize AI Studio end-to-end application lifecycle software platform for edge and automotive computing. Its GSP architecture underpins first-generation edge hardware released in 2020 and a multi-year pipeline of products. The company targets automotive (in-cabin, out-of-vehicle, and autonomous functions), smart retail, smart city/metro and industrial markets. Blaize emphasizes power-efficient performance advantages for electric vehicles and centralized automotive compute, positioning its SoCs to improve efficiency and lower cost. The company will use the $71M Series D to accelerate its product roadmap and develop next-generation hardware and software to meet demand for higher performance, lower power and lower cost AI solutions. Prior to the Series D Blaize had raised US$87M from strategic and venture backers and employs 300+ people with headquarters in El Dorado Hills, California and teams/subsidiaries in Campbell and Cary (US), Hyderabad, Manila and the UK. ThinCI is an Artificial Intelligence computing architecture startup developing computing platforms for the expanding AI/machine learning market. Its core product is the Graph Streaming Processor (GSP) and a Software Development Kit (SDK), a general purpose fully programmable computing architecture. The GSP and SDK are designed to accelerate and optimize machine learning, deep learning, neural networks and computer vision workloads. ThinCI targets deployment across data center servers, edge infrastructure platforms and client platforms, from massive machine learning farms to sensor fusion and advanced neural networks for autonomous driving. The company said it will use proceeds from the Series C to continue to expand operations. ThinCI is led by CEO Dinakar Munagala and has teams in California, Hyderabad, India and the UK. Thinci develops machine-learning technology, including silicon and software, to enable embedded deep learning and vision processing in electronic systems. Led by CEO Dinakar Munagala, the company targets automotive applications such as advanced driver assistance systems and autonomous driving. Its technology can also be integrated into personal electronics and smart home automation systems. Thinci's product focus is on embedding vision processing into vehicle electronics to improve thermal system efficiency and optimize powertrain productivity. The article does not disclose revenue, user metrics, or the financial terms of the investment.
- Seurat Technologies
Participated · Series C · Oct 2023
Seurat Technologies provides a 3D metal printing system designed for high-volume, decarbonized industrial production. The company intends to use new funding to accelerate its 3D metal printing technology and move from prototype to production. Seurat plans to deploy printing factories at or near customer sites worldwide to produce parts closer to demand, reshore supply chains, and reduce emissions from transportation and global logistics. Its pilot factory in the Greater Boston area will have capacity to produce more than 25 tons of metal parts annually and is already oversubscribed. Seurat has commitments to develop 59 tons of additively manufactured metal components for Siemens Energy over six years, LOIs from six customers totaling 4,000 tons of material, and over $750 million in projected revenue over the next several years. The company anticipates its technology could directly mitigate as much as 100 million tons of CO2 by 2030 and holds over 275 patents and trademarks, granted and pending. The company is led by CEO James DeMuth and is based in Wilmington, MA. Seurat Technologies provides scalable metal additive manufacturing technology and components manufacturing via its patented Area Printing platform. The Area Printing process decouples resolution and speed, enabling gains in lead time, cost, and quality. The technology originated at Lawrence Livermore National Laboratory; CEO and co-founder James DeMuth was a co-inventor and key developer. Seurat holds over 130 patents granted and pending. The process can be powered by 100% renewable energy and allows greater materials recycling, positioning the company to significantly reduce carbon emissions—0.15 GT of annual emissions displacement is expected by 2025. Seurat's commercialization program is slated to launch this year, and the company has received LOIs from leaders in automotive, aerospace, energy, and industrial manufacturing. Funding will support the initial commercial rollout, hiring, and development of a production-grade system. Seurat Technologies commercializes Area Printing, a metal additive manufacturing process that focuses over two million controllable laser points on a bed of metal powder to produce production-grade components. The process emphasizes per-point control of laser power and duration to deliver resolution, part integrity, and reliability at scale. Seurat says its first system generation will cut cost per part by about 50% versus today’s additive manufacturing technologies and that future printers could reach manufacturing costs below conventional die casting by 2030. The technology originated at Lawrence Livermore National Laboratory and was developed by a team that included Seurat’s CEO and co-founder James DeMuth. Seurat plans to use new funding to accelerate development and commercialization of Area Printing. The company is based in Wilmington, Mass., and previously raised $13.5 million in a Series A led by True Ventures in January 2018. Seurat Technologies builds industrial-scale metal printers aimed at cost-effective, high-throughput metal additive manufacturing. Its approach leverages technology originally developed at Lawrence Livermore National Laboratory and the company has applied for more than 20 patents. Seurat’s printers are designed for industrial scalability, likened to large-format laser engraving machines for manufacturing. The company intends to use new funds to accelerate commercialization of its metal additive manufacturing technology. Seurat was founded in July 2015 and is based in Boston, MA. Prior to this round it raised a $3.41M seed financing in June 2016 led by True Ventures.
- Quadric
Participated · Series B · Dec 2022
Quadric develops the Chimera GPNPU, a fully programmable general-purpose AI inference processor architecture optimized for on-device AI/ML inference and classic DSP and control algorithms. The Chimera processors scale from 1 to over 3,200 TOPS in multi-chiplet configurations and support both convolutional and transformer-based models, including on-device LLM inference and emerging VLA world models. Quadric's software toolchain converts AI models into C++ and enables SoC teams to program in Python or C++, allowing models to be updated on shipped silicon. The company offers automotive-grade safety-enhanced versions of its architecture and emphasizes a software-updatable approach so the same silicon can run models published after the chip was designed. Quadric reported that product revenues more than tripled in the prior year and that it reached profitability. The company is headquartered in Burlingame, California.
- Dellfer
Led · Series A · Oct 2021
Dellfer delivers a holistic cybersecurity solution for the automotive industry that provides high-level visibility and granular, actionable insights to detect and thwart intrusions in vehicles. The company offers an easy-to-deploy, out-of-the-box product with a user-friendly dashboard for continual over-the-cloud monitoring. Dellfer positions itself as the first and only provider with this level of holistic visibility and traceability for auto manufacturers. It is prioritizing acceleration to market in the core automotive sector while planning early introduction into other IoT sectors. Strategic partners are expected to support operational and sales-channel efforts as the company scales. The company recently announced an $8M Series A investment from DENSO and Option3. Dellfer is a San Francisco, California–based IoT and automotive cybersecurity startup led by CEO James Blaisdell. The company focuses on cybersecurity solutions to defend against "zero day" attacks within connected networks such as deployed IoT devices and, in the future, connected vehicles. Dellfer received a significant investment from Denso; the amount and terms were not disclosed in the article. The company said it will use the proceeds to build out its development team. Dellfer also plans to begin discussions with early adopter customers, including DENSO. No operating metrics or revenue figures were reported.
Team
Hiromi Tokuda
Executive Vice President
Kazuo Hironaka
Senior Executive Director
Akio Tajima
Senior Executive Director
Koji Kobayashi
Executive Vice President