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CYGNUSEMI

Room 401, 402, Building 5, No. 690, Bibo Road, Shanghai, China

Overview

Founded in October 2020, CYGNUSEMI (Shanghai Xinsi Semiconductor) develops full-scenario 5G/6G eMBB, RedCap and NTN baseband chips and system solutions that link terrestrial networks with low-earth-orbit satellites. Its first self-developed 5G eMBB chip, CS6810, achieved one-shot tape-out success in 2022, making the firm one of the few domestic players able to rival global giants such as Qualcomm and MediaTek. After pivoting toward low-orbit satellite internet, the company became the sole contractor for several national science projects and has completed end-to-end tests with major satellite constellations. CYGNUSEMI has already secured design-wins with two of the world’s top-six smartphone OEMs, two leading auto makers and multiple telecom-equipment providers, positioning it for large-scale commercial launches in the next 18-24 months. Financially, the firm raised a ¥100 m angel round in 2020, nearly ¥400 m Pre-A in 2021, >US$100 m Series A in early 2022 (valued at ~¥5 bn), and a ¥530 m down-round Series B in 2024 at a ¥3 bn pre-money valuation. The latest strategic financings lift the post-money valuation back above the unicorn threshold and provide fresh capital for product industrialization and mass production.

Total raised
$447M
Funding rounds
4
Latest round
Equity
Latest activity
Feb 2026

Industries

  • Hardware
  • Information Technology
  • Semiconductor
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Recent funding

  1. Equity

    Feb 2026

    $216M

  2. Series B

    Apr 2024

    $69M

  3. Series A

    Feb 2022

    $100M

  4. Series A

    Feb 2021

    $62M

Team

No current team members are available.