CYGNUSEMI
Room 401, 402, Building 5, No. 690, Bibo Road, Shanghai, China
Overview
Founded in October 2020, CYGNUSEMI (Shanghai Xinsi Semiconductor) develops full-scenario 5G/6G eMBB, RedCap and NTN baseband chips and system solutions that link terrestrial networks with low-earth-orbit satellites. Its first self-developed 5G eMBB chip, CS6810, achieved one-shot tape-out success in 2022, making the firm one of the few domestic players able to rival global giants such as Qualcomm and MediaTek. After pivoting toward low-orbit satellite internet, the company became the sole contractor for several national science projects and has completed end-to-end tests with major satellite constellations. CYGNUSEMI has already secured design-wins with two of the world’s top-six smartphone OEMs, two leading auto makers and multiple telecom-equipment providers, positioning it for large-scale commercial launches in the next 18-24 months. Financially, the firm raised a ¥100 m angel round in 2020, nearly ¥400 m Pre-A in 2021, >US$100 m Series A in early 2022 (valued at ~¥5 bn), and a ¥530 m down-round Series B in 2024 at a ¥3 bn pre-money valuation. The latest strategic financings lift the post-money valuation back above the unicorn threshold and provide fresh capital for product industrialization and mass production.
- Total raised
- $447M
- Funding rounds
- 4
- Latest round
- Equity
- Latest activity
- Feb 2026
Industries
- Hardware
- Information Technology
- Semiconductor
Recent funding
Equity
Feb 2026
$216M
Series B
Apr 2024
$69M
Series A
Feb 2022
$100M
Series A
Feb 2021
$62M
Team
No current team members are available.