Inpria develops metal oxide photoresists composed of tin-oxide nanoclusters optimized for extreme ultraviolet (EUV) lithography. Its metal-oxide resists provide higher resolution and strong etch selectivity versus traditional polymer-based resists, enabling simpler manufacturing flows, larger process windows, and potential reductions in cost of ownership. The company recently brought online a high-volume manufacturing plant to support an initial production ramp for customers. Inpria positions itself as a strategic supplier to semiconductor manufacturers adopting EUV patterning and highlights participation from photoresist, equipment and industrial chemical manufacturers among its backers. Financially, Inpria completed a $31 million Series C financing led by JSR Corporation with participation from SK hynix, TSMC Partners, Air Liquide Venture Capital (ALIAD), Applied Ventures, Intel Capital and Samsung Venture Investment Corporation. The funding and manufacturing scale-up are intended to accelerate market acceptance and broader adoption of its EUV photoresist platform. Inpria is a pioneer in high-resolution metal-oxide photoresists designed to unlock the full potential of EUV lithography. Its tin-oxide molecular resists offer substantially improved resolution compared with traditional polymer-based resists and can quadruple the efficiency of EUV photon absorption, improving sensitivity and reducing pattern variability. The materials provide high etch selectivity and act as patternable hardmasks, enabling simpler manufacturing flows, larger process windows, and reduced manufacturing cost. Inpria says its solution is purpose-built to support EUV at the 7nm process node and beyond. Fueled by growing customer demand, the company plans to complete a pilot manufacturing facility, commence commercial production, and grow its workforce to support more customer engagements and joint development of integrated processes. The company is based in Corvallis, Oregon. Inpria develops metal oxide photoresists aimed at extreme ultraviolet (EUV) lithography to enable semiconductor patterning at 7nm and beyond. Its inorganic thin-film resists are designed to improve imaging capability and simplify the pattern transfer process. The company said it recently improved resist sensitivity and has been working with partners on integration and performance needs. Inpria will use proceeds from the financing to complete product development and scale up manufacturing for its metal oxide photoresists. The announcement noted growing industry support for its novel patterning materials and development relationships. The company communicated optimism about 2016 as a pivotal year for its products. Inpria Corporation, based in Corvallis, Oregon and led by CEO Andrew Grenville, develops high-resolution photoresists and a portfolio of photo-condensed molecular oxides. Its materials aim to enable deposition directly from solution of atomically smooth, intrinsically dense, and directly photopatternable metal oxide films. The technology is positioned to deliver advanced performance with simplified processing. In June 2014 the company closed $1.45M in funding, led by the Oregon Angel Fund with a $1.0M investment and participation from individual members of the fund. Inpria said it will use the proceeds to accelerate technology development and to hire in Oregon. Earlier in February 2014 the company announced $7.3M in funding and commitments from Samsung Venture Investment Corporation, Applied Ventures, LLC and Intel Capital. Inpria develops patented inorganic photoresists and photo-condensed molecular oxides designed to extend Moore’s Law. The company focuses on extreme ultraviolet (EUV) lithography, delivering nanoscale imaging below 20nm to enable smaller electronic devices. Its portfolio also includes materials for other emerging semiconductor patterning technologies. Led by President and CEO Andrew Grenville, Inpria is commercializing these materials for next-generation chip manufacturing. The company is based in Corvallis, Oregon. Inpria received $4.7M of a committed $7.3M equity financing and intends to use the proceeds to expand the team and accelerate product development.

Total raised

$61M

Funding rounds

5

Latest round

Series C

Latest activity

Feb 2020