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The Venture Codex

Applied Ventures

3225 Oakmead Village Dr, Santa Clara, CA, 95051, United States

Overview

Applied Ventures, LLC is the venture capital fund of Applied Materials, Inc., (NASDAQ: AMAT), the global leader in nanomanufacturing technology solutions for the electronics industry with a broad portfolio of innovative equipment, service, and software products. At Applied Materials, they apply nanomanufacturing technology to improve the way people live. Applied Ventures invests in early-stage technology companies that promise to deliver high growth and exceptional returns. Their charter is to profitably invest in companies that provide a window on technologies that advance or complement Applied Materials' core expertise. Their investments help develop technologies and markets that provide natural extensions to Applied Materials' core business and stimulate the growth of applications for semiconductors, displays, solar PV, and related products and services.

Total investments
39
Lead investments
2
Investments · 12mo
2
Active investors
5

Sector focus

  • Advanced Materials
  • Manufacturing
  • Nanotechnology
  • Semiconductor
  • Venture Capital
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Investment portfolio

  • Mixx Technologies

    Participated · Series A · Dec 2025

    Mixx Technologies is a San Jose–based deep-tech startup building HBxIO™, a silicon-integrated, co-packaged optics (CPO) engine that provides rack-to-chip optical connectivity for AI inference and other high-performance computing workloads. By merging photonics with advanced packaging, the platform optimizes performance, power, latency and reliability at the datacenter scale and enables switch-less, highly parallel GPU clusters. The company positions its technology as a system-level solution that offers higher performance per dollar per watt, addressing the fundamental interconnect bottleneck in today’s AI architectures. Founded by former Broadcom CPO engineers Vivek Raghuraman and Dr. Rebecca K. Schaevitz, Mixx operates in the United States, India and Taiwan. Proceeds from its recent funding will be used to accelerate product development, expand its global footprint and scale R&D centers. No revenue or user metrics were disclosed in the article, but investor interest was strong enough to render the latest round oversubscribed.

  • Scintil Photonics

    Participated · Series B · Sep 2025

    Scintil Photonics builds integrated Photonic System-on-Chip (PSoC) products using its proprietary SHIP™ heterogeneous integration process, combining lasers, photodiodes, and modulators on a single chip. Its flagship LEAF Light™ is a DWDM-native single-chip light engine designed to deliver high bandwidth density (6.4 Tbps/mm) at roughly one-sixth the power consumption of conventional pluggable solutions. The technology targets co-packaged optics (CPO) for scale-up GPU clusters and emerging AI systems and is positioned to reduce data-centre energy per bit and associated carbon footprint. Scintil draws on more than 15 years of research at CEA-Leti and operates from Grenoble within Europe’s semiconductor ecosystem. The company is entering high-volume production of LEAF Light™ and plans global hiring and expansion, including strengthening its US presence. The business recently closed a $58M Series B to support its commercial ramp, production scale-up, and international expansion. Scintil Photonics develops and markets silicon photonic integrated circuits (PICs) with monolithically integrated lasers and optical amplifiers, including integrated laser arrays, multiples of 800 Gbit/sec transmitters and receivers, and tunable transceivers for near‑chip and chip‑chip communication. Its circuits are fabricated on a proprietary III/V‑Augmented Silicon Photonics technology and produced in a multi‑customer silicon foundry. The company also delivers control electronics and reference package implementations to accelerate customer adoption. Led by CEO Sylvie Menezo, Scintil sells CMOS‑compatible PICs and optical I/O aimed at optical interconnect markets. Scintil is based in Grenoble, France and Toronto, Canada and is currently taking its product to industrial level as it gears up for mass production. It raised €13.5M in a second financing to support industrialization and global commercialization. Scintil Photonics develops fully integrated silicon photonic circuits by combining silicon and indium phosphide using wafer-scale bonding to integrate multi-wavelength lasers, waveguides, filters and photodetectors. The company is fabless and relies on commercial silicon foundry processes to build its heterogenous photonic ICs. Management is led by CEO Sylvie Menezo and chairman Pascal Langlois. Scintil plans to use the funds to develop 800 Gbit/sec transceiver photonic circuit prototypes in commercial semiconductor foundries and to sample strategic customers in the data center market. The company will strengthen its team and development partnerships, including relationships with CEA-Leti and the University of Toronto. Scintil is gearing up to take its technology to an industrial level for mass production.

  • Rescale

    Participated · Series D · Apr 2025

    Rescale provides a unified digital engineering platform that combines cloud high-performance computing resources, intelligent data management tools, and applied AI to speed modeling and simulation workflows. The company maintains a market-leading library of over 1,250 engineering and R&D applications and a global network of more than 500 cloud datacenters through partners such as AMD, AWS, Arm, Intel, Microsoft Azure, NVIDIA, and Oracle Cloud Infrastructure. Rescale serves hundreds of enterprise customers across aerospace, automotive, energy, life sciences, manufacturing, public sector, and semiconductors; customers including Arm, General Motors Motorsports, Samsung, SLB, and the U.S. Department of Defense spend over $1 billion annually on HPC infrastructure that the platform supports. Planned roadmap priorities include expanding available workflows and compute technologies, establishing a unified data fabric and digital thread for modeling and simulation, adding AI-native search, tagging, and automation, and strengthening enterprise security and compliance with additional government and defense authorizations. The company emphasizes democratizing AI-powered engineering and automating AI Physics tool use, targeting large speed improvements in design validation. Financially, Rescale has raised a $115 million Series D and has now brought total funding to over $260 million. Rescale delivers a platform that enables organizations to run scientific and engineering simulations on public clouds (AWS, Azure, GCP, IBM, Oracle) and manage on-premises HPC resources, schedulers, and licenses. Its network spans 8 million servers with over 80 specialized architectures and resources (e.g., Nvidia Tesla P100 GPUs, Intel Skylake processors, >1TB RAM) delivering a combined 1,400 petaflops of compute. The platform supports workloads across aerospace, automotive, oil & gas, life sciences, electronics, academia, and machine learning, and includes a recommendation engine trained on billions of core hours to optimize performance. Rescale offers on-demand and long-term computing environments and pricing for single batch jobs, optimization jobs, and large designs of experiments, and has expanded its software catalog to more than 800 apps. Since its most recent February funding round the company added over 100 new customers and now counts 200 enterprise subscribers and 400 subscribers overall, including several Fortune 50 businesses. CEO Joris Poort says the new proceeds will be used to grow Rescale’s platform, service offerings, and workforce (the company has 200 employees and expects to grow to 300 in a year). Rescale is a hybrid high-performance computing (HPC) cloud platform delivering intelligent computing for digital R&D. Led by CEO Joris Poort and CTO Adam McKenzie, the company serves more than 300 customers ranging from startups to Fortune 50 enterprises. Rescale enables research scientists and engineers to run simulation and artificial intelligence workloads on the cloud provider of their choice using specialized hardware architectures and software templates optimized for their use cases. The platform requires no setup or maintenance from users. Rescale closed a $50m Series C round, bringing its total funding to over $100m. The company stated it intends to use the funds. Rescale helps companies move legacy high-performance computing (HPC) applications to the cloud or hybrid environments, providing HPC resources and tuning applications for maximum performance. The platform supports bare metal, virtual machines and containers and can leverage on-prem capital assets while extending workloads to different cloud vendors. Rescale targets engineering, aerospace, scientific and other verticals and currently serves about 150 customers, including Sikorsky Innovation, Boom Aerospace and Trek Bikes. The company was founded in 2011 and is based in San Francisco, with roughly 80 employees. Financially, Rescale has raised a total of $52 million to date and recently closed a $32 million Series B. The company plans to use the new capital to hire developers and solutions architects, expand in Asia and Europe, and build relationships with systems integrators to broaden market reach. Rescale provides enterprise-class high performance computing (HPC) platforms that help large enterprises transition from legacy on-premise systems to scalable, agile cloud computing infrastructure. Its platform is deployed securely via a web-based application environment powered by simulation software providers and backed by large HPC infrastructure. The company serves global Fortune 500 customers across aerospace, automotive, life sciences, marine, consumer products and energy sectors. Led by CEO Joris Poort, Rescale has attracted notable seed backers and strategic investors. The company raised a $14M Series A and intends to use the funds to expand worldwide. Total capital raised to date exceeds $20M.

  • Salience Labs

    Led · Series A · Feb 2025

    Salience Labs develops silicon photonics optical switches to connect AI datacenter clusters, targeting high bandwidth, low latency and significant power savings. Its switches are designed to be compatible with existing infrastructure and enable scalable, energy-efficient interconnect fabrics for large AI clusters. The company draws on over a decade of research from the University of Oxford and the University of Münster and was founded in 2021 in Oxford, England. Salience plans to further develop its optical switches, bring products to customers, and expand to the U.S. to serve key customers. It recently closed a $30 million Series A to accelerate development and go-to-market; no revenue or user metrics were disclosed in the article. Salience Labs develops an ultra-high-speed multi-chip processor that packages a photonics chip with standard electronics to accelerate AI computation. Its proprietary “on-memory compute” architecture combines the speed of photonics, the flexibility of electronics, and the manufacturability of CMOS. The company says its approach uses a broad bandwidth of light to execute operations and can stack up to 64 vectors into a beam, enabling highly scalable, densely parallel processing. Salience positions the technology as delivering far more calculation for the same power requirement, targeting more efficient AI systems. The company spun out of Oxford University and the University of Münster in 2021 and is based in Oxford. It recently raised funding to advance development and scaling of its photonics-enabled processors.

  • Ayar Labs

    Participated · Series D · Dec 2024

    Headquartered in San Jose, CA, Ayar Labs builds co-packaged optics that move data between chips with light instead of copper, reducing power consumption while boosting bandwidth for AI infrastructure. Its flagship TeraPHY optical engine is manufactured in concert with leading semiconductor partners and is designed to slot directly into existing accelerator and switch designs. By replacing traditional electrical I/O with optical links, the technology delivers significant performance gains and cost savings in power-constrained environments. Following its latest financing, the company plans to ramp production and testing capacity, open and staff a new office in Hsinchu, Taiwan, and deepen ecosystem partnerships to speed customer deployments. Ayar Labs’ CPO solution is already qualified for industry-standard fab, manufacturing, and packaging flows, positioning it for broad adoption. The company has raised a cumulative $870 million to date, providing substantial capital to execute its global expansion and commercialization roadmap.

Team