Scintil Photonics builds integrated Photonic System-on-Chip (PSoC) products using its proprietary SHIP™ heterogeneous integration process, combining lasers, photodiodes, and modulators on a single chip. Its flagship LEAF Light™ is a DWDM-native single-chip light engine designed to deliver high bandwidth density (6.4 Tbps/mm) at roughly one-sixth the power consumption of conventional pluggable solutions. The technology targets co-packaged optics (CPO) for scale-up GPU clusters and emerging AI systems and is positioned to reduce data-centre energy per bit and associated carbon footprint. Scintil draws on more than 15 years of research at CEA-Leti and operates from Grenoble within Europe’s semiconductor ecosystem. The company is entering high-volume production of LEAF Light™ and plans global hiring and expansion, including strengthening its US presence. The business recently closed a $58M Series B to support its commercial ramp, production scale-up, and international expansion. Scintil Photonics develops and markets silicon photonic integrated circuits (PICs) with monolithically integrated lasers and optical amplifiers, including integrated laser arrays, multiples of 800 Gbit/sec transmitters and receivers, and tunable transceivers for near‑chip and chip‑chip communication. Its circuits are fabricated on a proprietary III/V‑Augmented Silicon Photonics technology and produced in a multi‑customer silicon foundry. The company also delivers control electronics and reference package implementations to accelerate customer adoption. Led by CEO Sylvie Menezo, Scintil sells CMOS‑compatible PICs and optical I/O aimed at optical interconnect markets. Scintil is based in Grenoble, France and Toronto, Canada and is currently taking its product to industrial level as it gears up for mass production. It raised €13.5M in a second financing to support industrialization and global commercialization. Scintil Photonics develops fully integrated silicon photonic circuits by combining silicon and indium phosphide using wafer-scale bonding to integrate multi-wavelength lasers, waveguides, filters and photodetectors. The company is fabless and relies on commercial silicon foundry processes to build its heterogenous photonic ICs. Management is led by CEO Sylvie Menezo and chairman Pascal Langlois. Scintil plans to use the funds to develop 800 Gbit/sec transceiver photonic circuit prototypes in commercial semiconductor foundries and to sample strategic customers in the data center market. The company will strengthen its team and development partnerships, including relationships with CEA-Leti and the University of Toronto. Scintil is gearing up to take its technology to an industrial level for mass production.

Total raised

$77M

Funding rounds

3

Latest round

Series B

Latest activity

Sep 2025