JetCool builds patented microconvective liquid cooling® technology to manage heat in AI, high-density semiconductor, and high-performance computing applications. Its solutions are deployed by several major chipmakers and OEMs and aim to improve device efficiency, reliability, and sustainability. JetCool has partnered with Dell to integrate its SmartPlate System into next-generation PowerEdge servers and announced a collaboration with DuPont to expand adoption in semiconductor markets in Taiwan and Singapore. The company says demand from AI and high-density chips is driving growth and is positioning its products as essential for performance and resource savings. JetCool plans to use new capital to fuel global expansion and to advance its roadmap of next-generation liquid cooling solutions. JETCOOL Technologies develops microconvective liquid cooling® solutions aimed at reducing energy use and improving reliability for servers and other high‑power electronics. The company focuses on data center, high‑performance computing, and semiconductor markets. Its patented microconvective cooling technology is positioned to cut cooling energy and water use and lower carbon emissions when deployed at scale. JETCOOL was selected to participate in DOE ARPA‑E’s COOLERCHIPS program to further develop energy‑efficient cooling solutions. The company highlights potential global savings of 11.1 billion kilowatt‑hours of electricity, 150 billion liters of water per year, and avoidance of 35 million metric tons of CO2 through widespread deployment. JetCool’s team is led by CEO Dr. Bernie Malouin with engineering lead Dr. Ludwig Haber and specialists in mechanical and thermal engineering.

Total raised

$18M

Funding rounds

2

Latest round

Series A

Latest activity

Oct 2023