LIDROTEC builds proprietary laser systems that combine high-precision cutting with fluid-based cooling and cleaning to enable low-damage chip singulation. Its liquid-mediated laser dicing reduces material damage, narrows heat-affected zones, and cuts particle defects, which lowers breakage rates and increases yields—particularly for hard-to-dice materials and thin semiconductors. The company targets compound semiconductor, power device, photonics, and leading-edge semiconductor markets. LIDROTEC plans to use the funding to accelerate product development and commercialization, expand its team, and scale global delivery of its solutions. Financially, it has closed a $13.5 million Series A-2 financing co-led by Lam Capital and Goose Capital, with participation from ZEISS Ventures, NRW.BANK, Gründerfonds Ruhr and other investors. Company leadership and investors described the round as validation of the technology and a step toward broader commercial deployment. Lidrotec is a Bochum, Germany–based company that has developed a patent-pending wafer-dicing laser technology for the semiconductor industry. Its innovation uses liquids in the laser processing zone to cool and rinse wafers during cutting, producing thinner cuts, higher precision, clean surfaces, virtually no damage, and higher processing speeds without adapting production lines. Lidrotec won Round 5 of the Luminate NY accelerator and will receive a $1 million investment from New York State through the Finger Lakes Forward Upstate Revitalization Initiative. As part of the award, the company must establish operations in the Finger Lakes region for at least 18 months. Through Luminate NY Lidrotec was introduced to AIM Photonics, which is helping the company build infrastructure to develop the next iteration of its technology. CEO Alexander Igelmann said the program provided U.S. network, supplier, and client contacts that will help meet development milestones over the next two years, including market validation.

Total raised

$15M

Funding rounds

2

Latest round

Series A

Latest activity

Jun 2025