Participated · Equity · Nov 2025

Fabric8Labs, founded in 2015 and headquartered in San Diego, has created a patented Electrochemical Additive Manufacturing (ECAM) platform that builds metal parts atom-by-atom at room temperature, eliminating costly post-processing while achieving exceptional feature resolution and surface finish. The technology enables production of next-generation components such as direct-to-chip cooling structures, 3D antennas printed on PCBs, and high-current interconnects for electric vehicles. With ECAM, customers can move seamlessly from prototyping to high-volume output on a single manufacturing line. Backed by an ISO9001-certified, ITAR-registered U.S. facility, Fabric8Labs plans to expand production capacity from 5 million to 22 million components annually. The company is hiring across manufacturing, design, quality, and process engineering to meet demand from AI/HPC, wireless communications, and power electronics sectors. Its U.S. manufacturing presence also addresses supply-chain resiliency requirements for advanced electronics customers.

Participated · Series A · Aug 2025

OpenLight develops a heterogeneous III-V silicon photonics process and a foundry-validated process design kit (PDK) that integrates active and passive components—such as integrated lasers, modulators, amplifiers, and detectors—into custom PASICs. Its PDK is validated at Tower Semiconductor and is used by more than 25 companies to design and fabricate production-grade PASICs across datacom, telecom, AI data centers, sensing, and quantum computing. The company holds over 410 patents related to its PDK and manufacturing of heterogeneously integrated III-V photonics. OpenLight is advancing leading-edge components including 400G modulators and indium phosphide on-chip lasers and amplifiers, and plans to develop standards-based reference PICs at 1.6T and 3.2T. The firm aims to expand its PDK library, worldwide sales, and technical support as it scales; it is headquartered in Santa Barbara, California, with offices in Silicon Valley and has raised $84 million in total funding.

Led · Series B · Aug 2025

Multibeam builds production-grade multi-column electron-beam lithography (EBL) tools that offer a full-wafer field of view, exceptional depth of focus, maskless writing, and the ability to create unique patterns. The company shipped its first EBL production system last year and has seen increased interest from semiconductor manufacturers. Its platform is positioned to enable new chip designs for quantum computing, photonics, advanced packaging and other emerging applications. Multibeam plans to accelerate development of a next-generation EBL platform for 300mm wafers and panel-level maskless lithography. The company says these capabilities can support denser interconnects, lower energy consumption and higher performance for AI and related technologies. Strong partnerships with industry investors are expected to aid its next phase of growth.

Led · Series A · Jun 2025

LIDROTEC builds proprietary laser systems that combine high-precision cutting with fluid-based cooling and cleaning to enable low-damage chip singulation. Its liquid-mediated laser dicing reduces material damage, narrows heat-affected zones, and cuts particle defects, which lowers breakage rates and increases yields—particularly for hard-to-dice materials and thin semiconductors. The company targets compound semiconductor, power device, photonics, and leading-edge semiconductor markets. LIDROTEC plans to use the funding to accelerate product development and commercialization, expand its team, and scale global delivery of its solutions. Financially, it has closed a $13.5 million Series A-2 financing co-led by Lam Capital and Goose Capital, with participation from ZEISS Ventures, NRW.BANK, Gründerfonds Ruhr and other investors. Company leadership and investors described the round as validation of the technology and a step toward broader commercial deployment. Lidrotec is a Bochum, Germany–based company that has developed a patent-pending wafer-dicing laser technology for the semiconductor industry. Its innovation uses liquids in the laser processing zone to cool and rinse wafers during cutting, producing thinner cuts, higher precision, clean surfaces, virtually no damage, and higher processing speeds without adapting production lines. Lidrotec won Round 5 of the Luminate NY accelerator and will receive a $1 million investment from New York State through the Finger Lakes Forward Upstate Revitalization Initiative. As part of the award, the company must establish operations in the Finger Lakes region for at least 18 months. Through Luminate NY Lidrotec was introduced to AIM Photonics, which is helping the company build infrastructure to develop the next iteration of its technology. CEO Alexander Igelmann said the program provided U.S. network, supplier, and client contacts that will help meet development milestones over the next two years, including market validation.

Participated · Seed · Apr 2025

Corvic AI provides a Data-Centric AI Cognitive Infrastructure that converts proprietary enterprise data (tabular, relational, text, image, time series) into AI-ready intelligence using its Mixture of Spaces (MoS) and Adaptive Chain of Actions (ACoA) technologies. Its Agentic Function Calling architecture orchestrates multi-step analytics and tool use to deliver explainable, auditable answers across complex, siloed data. The platform is designed for plug-and-play integration with existing enterprise ecosystems to accelerate adoption without disrupting workflows. Corvic AI targets mission-critical use cases in advanced manufacturing, industrial, financial services, and life sciences where accuracy and reliability are essential. The company says its infrastructure helps enterprises move generative AI projects from prototyping into production. Financially, Corvic AI announced a $12 million seed funding round to support product development and go-to-market efforts.