Multibeam builds production-grade multi-column electron-beam lithography (EBL) tools that offer a full-wafer field of view, exceptional depth of focus, maskless writing, and the ability to create unique patterns. The company shipped its first EBL production system last year and has seen increased interest from semiconductor manufacturers. Its platform is positioned to enable new chip designs for quantum computing, photonics, advanced packaging and other emerging applications. Multibeam plans to accelerate development of a next-generation EBL platform for 300mm wafers and panel-level maskless lithography. The company says these capabilities can support denser interconnects, lower energy consumption and higher performance for AI and related technologies. Strong partnerships with industry investors are expected to aid its next phase of growth.

Total raised

$31M

Funding rounds

1

Latest round

Series B

Latest activity

Aug 2025