SEMRON develops a proprietary CapRAM™ semiconductor architecture that uses a memcapacitor-based approach to minimise electron movement and improve energy efficiency for AI inference. The design enables three-dimensional stacking of silicon dies and in-memory chiplets, supporting AI models reportedly 2–300× larger and potentially up to 1,000× in the future. CapRAM™ delivers about a 20-fold increase in energy efficiency at the chip level and avoids overheating, enabling high-density layer growth on a single substrate. The technology leverages conventional semiconductor materials, which the company says can reduce production development costs by up to €100 million. SEMRON positions its chips to address cost, memory density and flexibility limitations of current transistor-based approaches, aiming to run large AI models on very small devices. With the new funds, the company plans to accelerate hardware and compiler development, expand the team, and pursue internationalisation, targeting a fourfold team increase by year-end. The company is led by CEO Aron Kirschen and CTO Kai-Uwe Demasius.

Total raised

$8M

Funding rounds

1

Latest round

Seed

Latest activity

Jan 2024