SK Fine
7-2-10, Nojihigashi, Kusatsu-shi, Shiga, 525-0058, Japan
Overview
エスケーファイン was founded in 2018 from joint research between Photo Chemical and Osaka University and leverages jointly filed patents to develop 3D printers that use ceramics as build materials. Its core products and services are 3D ceramic printers, ceramic 3D-printing materials, contract part manufacturing, and contract development and verification work. The company says its ceramic 3D printing technology delivers very high strength and high-detail parts and can print using customers' materials, positioning it ahead of many competitors. エスケーファイン combines Osaka University element technologies with its own precision drawing, material formulation, and mixing techniques to overcome technical challenges in ceramic additive manufacturing. Market demand for its equipment is described as strong, and the company plans to use recent investment to accelerate further performance improvements of its machines. OUVC will continue hands-on support, including dispatching a director, while the company continues sales, manufacturing, and development services. SK-Fine is an open-innovation venture founded in October 2018 that develops and markets 3D ceramic printers, printer materials, and printed ceramic components. The company commercialized a 3D ceramic printer early in Japan by applying joint research and patent rights from Photo Chemical Co. and Osaka University. SK-Fine combines Osaka University’s element technologies with its own precision drawing, material formulation, and mixing techniques to overcome technical challenges of ceramic additive manufacturing. Its printed ceramic parts target markets that benefit from ceramic properties—high hardness, oxidation resistance, and heat tolerance—such as artificial bone, dental materials, and electronic components. The company also offers contract manufacturing, commissioned development/verification, and prototype research services. With strong market interest, SK-Fine is focused on further improving equipment performance and expanding commercial adoption.
- Total raised
- $1M
- Funding rounds
- 2
- Latest round
- Equity
- Latest activity
- May 2022
Industries
- 3D Technology
- Electronics
- Manufacturing
Recent funding
Equity
May 2022
$0M
Equity
Apr 2021
$1M
Team
Hideshi Sasaki
CEO and President