Tempow
Paris, Ile-de-France, France
Overview
Tempow develops software-only Bluetooth stack innovations designed to enhance accessory connectivity, extend battery life, enable multi-output audio sharing, and improve protocol security. Its first commercial product, the Tempow Audio Profile (TAP), is an updated Bluetooth protocol that allows any Bluetooth chip to stream audio to multiple outputs simultaneously and is a 100% software solution compatible with any brand of Bluetooth speaker. TAP was selected by Motorola for the Moto X4, and millions of handsets featuring the TAP software stack are currently in the market globally. Founded in 2016, Tempow is headquartered in Paris with extended operations in Seoul and Shenzhen and works directly with hardware and chipset manufacturers and the Bluetooth Special Interest Group. The team comprises twelve engineers, including alumni from Ecole Polytechnique and 42. Tempow plans to use new funding to close distribution deals with hardware manufacturers and to double the size of its global team. Tempow develops a patented technology that layers on top of the Bluetooth protocol to stream audio simultaneously to multiple Bluetooth speakers and let users control volume, channel direction, and speaker mapping from a single application. The app pairs speakers one at a time and runs quietly in the background while streaming from services like Spotify or YouTube. The company is not currently shipping a consumer app; instead it is pursuing white‑label and OEM integrations with manufacturers in the U.S. and Asia. Tempow’s founder and CEO Vincent Nallatamby said the startup is in discussions with large manufacturers and hopes to sign partners by Mobile World Congress. The team of seven is based in France and has extended operations to San Francisco, and is part of the first batch of The Refiners accelerator. Tempow has raised an undisclosed angel round from French investors.
- Total raised
- $4M
- Funding rounds
- 2
- Latest round
- Series A
- Latest activity
- May 2018
Industries
- Audio
- Consumer Electronics
- Mobile Devices
- Semiconductor
- Software
- Wireless
Recent funding
Series A
May 2018
$4M