TeraSi develops proprietary system-in-package technology to address packaging and integration challenges for high‑frequency chips above 60 GHz, targeting future wireless generations including 6G. The company showcased scalable E‑band waveguide array antennas for 5G and future wireless at the EuCNC & 6G Summit. With the new funding it plans to invest in manufacturing infrastructure and pursue an aggressive IP strategy. TeraSi intends to launch new products tailored to test & measurement, radar and wireless markets. The company was established in 2020 by three co‑founders and leverages academic research from KTH Royal Institute of Technology alongside internal R&D. CB Insights notes prior backing from multiple angel and institutional investors.

Total raised

$1M

Funding rounds

1

Latest round

Seed

Latest activity

Aug 2023