Thintronics develops a suite of high-performance insulator materials that claim electrical and mechanical characteristics exceeding the state of the art. Its new generation of isotropic, skew-free, ultra-low loss and low-Dk dielectric materials can be applied as ultra-thin coatings directly onto chips and interconnects to minimize signal loss and energy dissipation in high-speed data channels. The coatings also reduce the need for fiberglass for PCB structural rigidity, enabling greater flexibility for high-performance boards and semiconductors. The company positions its technology to cut data center energy loss from electromagnetic radiation and heat dissipation. Thintronics says it aims to optimize the interconnect insulator and unify it across the fabric of modern electronics. Management frames the technology as an ecosystem enabler for architectures such as interposer-less 2.1D, chiplets, and heterogeneous co-packaging and intends to leverage partnerships to accelerate commercialization. Thintronics develops a suite of high-performance interconnect insulator materials that the company says outpace the state of the art in electrical and thermo-mechanical performance. Its core product is an ultra-thin dielectric/insulator platform designed to improve bandwidth, power efficiency, signal integrity, and form-factor optimization for chipsets, switches, datacenter integrators, networking, AI acceleration, RF mmW communication, and radar. The company plans to commercialize this insulator platform to support higher-speed standards such as 224G links and beyond and to enable multi-chip packaging and PCB-level solutions as Moore’s Law limits scaling. Thintronics emphasizes domestic sourcing of components and aims to onshore advanced packaging technologies and vertically integrate supply chains. The company raised a $23M Series A to fund commercialization of its technology. Leadership includes CEO Stefan Pastine and CTO Tristan El Bouayadi, and investors highlighted the firm's potential to solve critical electrical performance bottlenecks across the interconnect fabric.

Total raised

$23M

Funding rounds

2

Latest round

Series A

Latest activity

Apr 2024