Participated · Series A · Oct 2025

Luxquanta was founded in May 2021 as a spin-off of ICFO and develops and commercializes quantum-safe encryption solutions centered on continuous-variable QKD (CV-QKD). The company targets telecommunications, public administrations, data centers and critical infrastructure, and reports customers in more than a dozen European countries with deployments in Asia-Pacific, Latin America and the United States. Its team comprises engineers with decades of experience in quantum technologies, FPGA development, telecommunications, digital signal processing, microelectronics, software development and optoelectronic components. Luxquanta positions itself to make quantum security accessible and has rapidly developed its technology since inception. The article does not report revenue, user counts, or other financial metrics.

Participated · Series B · Feb 2023

Light Field Lab is a San Jose, CA–based developer of the SolidLight holographic display platform. Its core product, SolidLight, is a resolution holographic display platform that enables real digital objects to form in mid-air without headgear using self-emissive bezel-less panels that assemble into modular holographic video walls. The company offers a system solution combining hardware and software for a wide range of next-generation experiences and has unveiled Defy experiences; the first, Space and Time, allows users to speak and interact with SolidLight holograms. Led by CEO Jon Karafin, Light Field Lab provides a roadmap of technologies intended to merge real and virtual worlds. The company raised new capital to accelerate productization and deployments across enterprise and location-based entertainment applications. Light Field Lab is a Bay Area startup building holographic "light field" displays that enable volumetric 3D viewers can see from multiple perspectives without glasses. Its core product is a modular holographic screen platform designed to let venues stack devices into large 3D video walls that make digital content appear to float mid-air. The company is initially targeting large-format, location-based entertainment venues rather than at-home consumers. Light Field Lab emerged from stealth two years ago and says a consumer version of its holographic technologies will ultimately be developed. Financially, the company has secured VC backing to support its ambitions, announcing a new Series A and having raised capital the prior year. Light Field Lab is building light-field holographic display systems that project real-seeming 3D objects into space without accessories or head-mounted gear. The company is developing prototype modules (initially 6" by 4") and plans production modules about 2 feet by 2 feet with 16K by 10K resolution. Those production modules are designed to be stitched into very large displays (up to ~100 feet wide) for venues such as theme parks, concerts, and location-based entertainment. Light Field Lab targets both professional and consumer markets and ultimately hopes to build holographic video walls with hundreds of gigapixels of resolution. The startup was founded in 2017 by Jon Karafin, Brendan Bevensee, and Ed Ibe and has a handful of employees and contractors, with expansion planned in 2018. The company raised $7 million in seed funding to complete a prototype of its light-field display system.

Participated · Series A · Sep 2022

Brelyon, an MIT spin-off, builds headless immersive displays (Ultra Reality) that use patented light-field and wavefront engineering to generate panoramic virtual screens without headsets. Its hardware stack produces optical depth layers and a wide field of view intended to deliver headset-like immersion while working with existing content. The company demonstrated its tech at CES and has onboarded more than 20 companies into an early access program. Brelyon is focused short-term on scaling manufacturing and software to improve unit economics and to apply manufacturing developments across future products. It is pursuing enterprise pilots and partnerships as a path to market, including a strategic relationship with LG Display. The firm plans to use capital to grow pilot programs and build a manufacturing foundation to move from enterprise into broader metaverse opportunities.

Participated · Series D · Apr 2022

DigiLens is an innovator in head‑worn holographic display and waveguide technology, including volume Bragg gratings and the full‑color Crystal30 waveguide. The company supplies optics for XR use cases across automotive, enterprise, consumer, avionics, and military sectors and enables OEM partners via a patented optical platform and low‑cost contact‑copy manufacturing process. DigiLens says its next‑generation waveguide technology delivers higher performance at lower cost, enabling wider fields of view, improved uniformity, and fewer substrates for full‑color waveguide lenses. Management expects these advances to appear in the market in a material way over the next year and to extend the company’s lead versus competitors. The company is strengthening a licensing business model and expanding global offerings through strategic partners for glass and plastic substrates. Following the Series D second close, DigiLens reported more than $50 million in new investments and a valuation of over $530 million. DigiLens develops waveguide displays that project images through etchings in thin sheets of glass for AR headsets and see-through automotive displays. The company is focused on lowering the cost of waveguides to reach consumer price points through its manufacturing process. CEO Chris Pickett said the startup is building “the only waveguide that can get to a consumer price point.” DigiLens aims to enable svelte, high-definition AR designs that avoid bulky optics. The startup is based in Sunnyvale, Calif., and faces competition from major tech companies and other startups working on waveguide technology. DigiLens manufactures waveguide displays that enable mostly transparent AR headset screens by reflecting light through printed reflective elements on glass. The company’s manufacturing process ‘prints’ those reflective features directly onto glass sheets, which it says helps keep costs lower than competitors. While DigiLens has received press for miniature waveguide displays for first-generation AR headsets, it has found more immediate opportunity in making heads-up displays for cars and motorcycle helmets. Sunnyvale-based DigiLens announced a $25 million Series C investment from Continental, which now holds an 18% equity stake. The company has raised $60 million in funding to date, with investors that include Sony and Foxconn according to Crunchbase. The article positions DigiLens as a component maker continuing to develop enabling technologies amid broader uncertainty around consumer AR use cases. DigiLens is a Sunnyvale, CA–based developer of diffractive optical waveguide technology and nanomaterials for augmented and virtual reality. Its core product is a holographic optical waveguide that can steer and manipulate light using a variety of diffractive structures, some of which are electrically switchable, enabling wavelength and angular selectivity. The company supplies Optical Design/Tools, Parts Supply, Manufacturing Design/Tools and Material Supply and typically customizes prototype designs for customers from a library of Optical IP Cores. Led by founder and CEO Jonathan Waldern, DigiLens serves the aerospace, security and consumer electronics industries. With the $22m Series B financing, the company intends to bring several augmented reality displays and sensors to market for enterprise, consumer and transportation applications. Backers include both strategic and venture investors, reflecting interest from industry partners and financial firms.

Participated · Series B · Jan 2022

3D Glass Solutions is a U.S.-based maker of glass-ceramic, three-dimensional integrated passive components and system-in-package devices using its patented APEX® photosensitive glass-ceramic technology. The company combines innovative glass process technologies with high-volume semiconductor manufacturing equipment to produce cost-effective, high-precision components for RF, photonic and datacenter applications. Its products offer low loss, high power handling, excellent thermal stability and ultra-low transmission loss across 1–200 GHz, enabling performance not possible with traditional 2D components. 3DGS serves markets including 5G, aerospace, healthcare, autonomous driving, automotive radar, mobile handsets, IoT, and defense. The company reports an ongoing increase in revenue and will use the new funding to expand U.S.-based manufacturing and production wafer capacity and accelerate its product roadmap for 3D heterogeneous integration solutions. It holds foundational patents across materials, design, systems and manufacturing for photosensitive glass-ceramic devices and offers device manufacturing and systems integration services for standard and custom products. 3D Glass Solutions (3DGS) develops and manufactures glass-based 3D passive RF devices and SiP components using its patented low-loss photosensitive APEX® glass-ceramic technology. The company supplies high-precision, high-frequency, low-loss products for automotive radar, IC electronics, medical, aerospace, defense, wireless infrastructure, mobile handset and IoT markets. 3DGS owns foundational patents across materials, design, systems and manufacturing for photosensitive glass-ceramic devices. Recent commercial activity includes a licensing agreement with Corning for through glass vias (TGV) processes in Corning HPFS fused silica and a long-term glass wafer supply agreement with Corning. 3DGS has a long-term supply agreement to provide components to Menlo Microsystems for its Ideal Switch™ as an initial use of the Corning-enabled technology. The company leverages its IP and manufacturing capabilities to expand into adjacent markets enabled by TGV and advanced glass packaging. 3D Glass Solutions fabricates electronic packages and devices using photo-definable, low-loss APEX® glass-ceramic technology to produce glass-based, three-dimensional passive RF components and system-in-package (SiP) devices. Its process yields low RF material loss, ultra-low transmission loss, precise 3D structuring of through-glass vias, and fine-line metallization enabling high interconnect density while minimizing warp. Target end markets include 5G and wireless infrastructure, automotive radar and autonomy, aerospace and defense, medical, mobile handsets and IoT. The company holds foundational patents covering photosensitive glass-ceramic materials, design, systems and manufacturing for glass-ceramic electronic packaging. 3DGS plans to use the Series B1 proceeds to purchase high-volume manufacturing equipment, expand cleanrooms, and increase production, sales management and engineering headcount to support rapidly growing customer demand. Management described the Series B1 as a monumental growth inflection point and part of an aggressive revenue growth strategy focused on transitioning to higher-volume production.