Participated · Equity · May 2026

Flora offers three main products: Wellflow, a corporate service to support female employee health and corporate decision-making; Flora Expert, a business support service that extracts insights for new business and product planning with a track record across more than 30 companies and over 50 implementations; and Moonly, a self-care app covering menstruation to menopause with over 200,000 downloads. The company leverages proprietary AI algorithms and accumulated women's health data to provide personalized support and extract insights for corporate clients. Flora plans to expand Wellflow's functionality, scale Flora Expert including overseas deployment, and enhance Moonly's AI healthcare functions and data infrastructure. To support these plans it intends to hire additional engineers and data scientists. Financially, the company has raised approximately ¥230 million in the latest round, bringing total funding to about ¥500 million, and the financing includes loans from financial institutions. Flora aims to accelerate expansion into Asian markets such as South Korea and Taiwan.

Participated · Series A · Apr 2026

Founded in 2023 by Yuma Sasaki in Ethiopia, Dodai assembles electric motorcycles and batteries locally and operates an infrastructure of battery-exchange stations that let riders swap depleted batteries. Since launch the company reports it has assembled and deployed more than 2,000 electric motorcycles. Dodai raised $7 million in 2024 and has now completed a $13 million Series A that mixes $8 million in equity and $5 million in debt. The company plans to use the new funding to expand its battery-swap network in Addis Ababa—aiming for 30 stations and 3,000 users within 12 months—and to scale to 30,000 users and 1,000 stations over three years. Dodai also targets regional expansion to several African cities starting in 2028, leveraging its integrated model of local assembly plus battery-exchange infrastructure.

Led · Seed · Nov 2025

NexaScience is developing a unified platform that lets AI agents and robotics autonomously carry out the full scientific cycle—literature review, hypothesis creation, experimentation, IP filing, and business development. Its early modules include NexaPapers, an AI-integrated research-workflow product based on the AIRAS framework, and NexaPatents, a service that automates IP tasks. The company plans to enhance its orchestration AI to serve as an enterprise agent foundation and to formally launch the full “Nexa Series” suite while scaling hiring across R&D, engineering, BizDev, and sales. In 2026 it aims to expand joint PoCs with large chemical and manufacturing firms and convert the workflows into production-grade products, followed by global expansion in 2027. The firm, incorporated in October 2024 and headquartered in Shibuya, Tokyo, has raised ¥61 million in pre-seed financing to fund these initiatives. No revenue or user metrics have yet been disclosed.

Participated · Series B · Nov 2021

3D Glass Solutions is a U.S.-based maker of glass-ceramic, three-dimensional integrated passive components and system-in-package devices using its patented APEX® photosensitive glass-ceramic technology. The company combines innovative glass process technologies with high-volume semiconductor manufacturing equipment to produce cost-effective, high-precision components for RF, photonic and datacenter applications. Its products offer low loss, high power handling, excellent thermal stability and ultra-low transmission loss across 1–200 GHz, enabling performance not possible with traditional 2D components. 3DGS serves markets including 5G, aerospace, healthcare, autonomous driving, automotive radar, mobile handsets, IoT, and defense. The company reports an ongoing increase in revenue and will use the new funding to expand U.S.-based manufacturing and production wafer capacity and accelerate its product roadmap for 3D heterogeneous integration solutions. It holds foundational patents across materials, design, systems and manufacturing for photosensitive glass-ceramic devices and offers device manufacturing and systems integration services for standard and custom products. 3D Glass Solutions (3DGS) develops and manufactures glass-based 3D passive RF devices and SiP components using its patented low-loss photosensitive APEX® glass-ceramic technology. The company supplies high-precision, high-frequency, low-loss products for automotive radar, IC electronics, medical, aerospace, defense, wireless infrastructure, mobile handset and IoT markets. 3DGS owns foundational patents across materials, design, systems and manufacturing for photosensitive glass-ceramic devices. Recent commercial activity includes a licensing agreement with Corning for through glass vias (TGV) processes in Corning HPFS fused silica and a long-term glass wafer supply agreement with Corning. 3DGS has a long-term supply agreement to provide components to Menlo Microsystems for its Ideal Switch™ as an initial use of the Corning-enabled technology. The company leverages its IP and manufacturing capabilities to expand into adjacent markets enabled by TGV and advanced glass packaging. 3D Glass Solutions fabricates electronic packages and devices using photo-definable, low-loss APEX® glass-ceramic technology to produce glass-based, three-dimensional passive RF components and system-in-package (SiP) devices. Its process yields low RF material loss, ultra-low transmission loss, precise 3D structuring of through-glass vias, and fine-line metallization enabling high interconnect density while minimizing warp. Target end markets include 5G and wireless infrastructure, automotive radar and autonomy, aerospace and defense, medical, mobile handsets and IoT. The company holds foundational patents covering photosensitive glass-ceramic materials, design, systems and manufacturing for glass-ceramic electronic packaging. 3DGS plans to use the Series B1 proceeds to purchase high-volume manufacturing equipment, expand cleanrooms, and increase production, sales management and engineering headcount to support rapidly growing customer demand. Management described the Series B1 as a monumental growth inflection point and part of an aggressive revenue growth strategy focused on transitioning to higher-volume production.

Led · Series C · Nov 2014

C3Nano commercializes silver nanowire (AgNW) technologies and transparent conductive inks and films for touch sensors, displays and other electronic applications. Its NanoGlue® and ActiveGrid™ technologies fuse conductive silver nanowires into high-performance conductive networks to lower sheet resistance while preserving optical transparency, low haze, and low reflectivity. The company holds more than 120 global patents (issued or pending) underpinning its electronic materials platform. Its products are used by manufacturers of mobile devices, notebook computers, tablets, large-area interactive TVs, and automotive sensor applications. Headquartered in Silicon Valley, C3Nano operates manufacturing, sales, and technical support facilities in the U.S. and Asia. The company plans to expand its Hayward, California silver nanowire synthesis and production capacity and to accelerate commercialization of its nanowire-based technologies in 2023 and beyond; it recently completed a $35M growth capital financing to support those efforts. C3Nano develops next-generation transparent conductive inks and films used by manufacturers of mobile devices, notebook computers, tablets, large-area interactive TVs and automotive sensors. The company holds more than 75 global patents (issued or pending), including multiple patents covering its NanoGlue® technology. Led by CEO Clifford Morris, C3Nano operates manufacturing, sales and technical support facilities in the U.S. and in Asia. Its core products target the touch sensor and flexible display markets. C3Nano is collaborating with investors and partners to further develop the supply-chain channel for the global flexible display market. The article does not disclose revenue or user metrics. C3Nano is a performance leader in solution-based transparent conductive inks and films for the touch sensor and display industry. Its products are positioned as direct replacements for indium tin oxide (ITO) and target OLED and flexible display markets. Founded in 2010 as a Stanford University spinout, the company is headquartered in Hayward, California, with an industry-leading manufacturing base in South Korea and sales and technical support in China and Taiwan. C3Nano closed a $15 million Series D equity financing and has raised $37 million in total equity since inception. The company will use the new funding to build manufacturing operations in China, increase capacity in South Korea, and strengthen its presence in Asia to support sales growth and global customers. The financing will also fund new technology development and innovation at its Hayward headquarters. C3Nano develops solution-coated transparent conductive materials, including its recently launched Active-grid™ product, as an alternative to indium tin oxide (ITO). Active-grid™ is positioned for high conductivity, strong optical performance, solution coat-ability, and environmental durability. The company works with global and Asia-based partners across the consumer electronics supply chain—chemical companies, converters, coaters, and device makers—and targets touch panels, thin-film PV, OLED lighting, and smart windows. C3Nano was founded in 2010 as a spinout from Professor Zhenan Bao’s Stanford lab and is headquartered in Hayward, California. The company is backed by venture capital firms and strategic corporate investors and is expanding manufacturing and R&D to support market demand and new product development. C3Nano develops a nanomaterials-based transparent conductive film used in flexible displays, touch screens, solar cells and smart windows. The technology is based on research by Dr. Melbs LeMieux and Dr. Ajay Virkar, with board member Prof. Zhenan Bao at Stanford. Founded in January 2010 and led by CEO Cliff Morris, the company is based in Hayward, California. It raised a $6.7M Series B in February 2012 and has raised in excess of $10M to date. C3Nano intends to use the funding to expand engineering capability, complete its ink product, and scale to production. In conjunction with the financing, Dr. Nobi Kambe of Phoenix Venture Partners will join the company’s board of directors.