Participated · Series A · Apr 2026

Founded at the end of 2020, Ruimeng Semiconductor develops active heat-dissipation microsystem products spanning piezoelectric fans, MEMS fans, micro-pump liquid cooling, and pump-driven vapor chambers for edge devices, as well as jet micro-channel cold plates, MLCP micro-channel covers, and two-phase heterogeneous integrated microsystems for cloud/AI training and inference chips. The company is led by founder & CEO Li Bing, a professor and doctoral supervisor with nearly 20 years of research in piezoelectric MEMS sensors and actuators, and leverages Shenzhen University as a shareholder via technology transfer. Ruimeng emphasizes cross-disciplinary integration across materials, devices, processes, fluids, chips, and algorithms, and has formed strategic production and quality partnerships with Feirongda. It co-launched piezoelectric fan technology with Transsion at CES in January 2026 and has a product matrix targeting mobile phones, tablets, laptops, wearables, and high-density AI computing scenarios. The company is expanding R&D, building a mass-production demonstration line, and investing in customer-introduction and distribution channels to support commercialization and large-scale delivery. The article did not disclose revenues, users, or other financial operating metrics.