Participated · Equity · Apr 2024

Arris has developed a patented advanced manufacturing technology platform that prioritizes specific stiffness and strength for continuous fiber-reinforced thermoplastic composite structures. The company created a new manufacturing category called Additive Molding, a software, materials, and high-volume production approach to producing composite parts at scale. Its technology targets footwear, bicycles, portable electronics, automotive, aerospace, and industrial markets. Founded in 2017 and based in Berkeley, California, Arris intends to use the funds to scale its global operations. Growth actions include continued performance-driven innovation, strategic go-to-market initiatives, and expansion of ingredient brand partnerships with an emphasis on consumer products and aerospace applications. The company raised $34M from a mix of strategic and institutional backers to support those efforts. Arris Composites is a US additive manufacturing startup. The article identifies the company as operating in additive manufacturing but provides no further product or technology details. Arris completed a Series C financing, raising US$88.5 million. The amount raised exceeded the company's estimated target for the round. The report did not disclose participating investors, prior funding rounds, founding year, or operating metrics such as revenue or user numbers. No future plans or use of proceeds were detailed in the article. Arris Composites mass-produces high-strength, lightweight carbon-fiber composite parts using its proprietary Additive Molding manufacturing technology. The process enables advanced carbon-fiber materials to be produced at speeds comparable to plastic-molded products, allowing mass production of complex, highly integrated parts. Its technologies have been used in aerospace, automotive, and consumer products markets. Arris also employs a new generation of recyclable composites and designs products so end-of-life waste can become feedstock for future products. The company provides in-house design collaboration and application engineering tools so customers can design and produce previously impossible products that are stronger and lighter than metals. Arris is based in Berkeley, California, was founded in 2017, and is planning to expand operations following its recent fundraising. Former Autodesk CEO Carl Bass is joining the board as an independent director and has been involved since 2017 as an angel investor, advisor, and research collaborator. Arris Composites develops next-generation continuous carbon fiber composites that can be combined with metals, plastics, wires and other materials for aerospace, automotive and consumer products. The company spent the prior two years in stealth developing these materials. It was founded by manufacturing innovation veterans Ethan Escowitz, Riley Reese and Erick Davidson, who serves as founder and CEO. Arris is based in Berkeley, California. The company will use new funding to expand operations and continue development efforts. Its current financing indicates early-stage capital support for scaling production and R&D.

Participated · Equity · Apr 2023

EdgeQ develops a "Base Station-on-a-Chip" that converges 4G and 5G with on‑chip AI and provides a production-grade PHY for O-RAN Distributed Units and small cells. Its massively integrated 4G+5G+AI chip leverages RISC-V and ARM architectures to compress a rack of base station equipment into a small, power-efficient package. The platform is multi-mode and software-upgradeable, intended to enable wholesale upgrades without ripping and replacing existing network configurations and to reduce vendor lock-in. EdgeQ states the solution is available now and that customer deployments are expected this year. The company plans to use the new funding to ramp production to meet customer demand and to develop its next-generation chip. EdgeQ is headquartered in Santa Clara, CA, with offices in San Diego and Bangalore and is led by executives from Qualcomm, Intel, and Broadcom. EdgeQ is building a systems‑on‑a‑chip that integrates 5G connectivity and on‑board AI while operating within a tight power envelope and remaining reprogrammable. The product is still under development and the company has not disclosed full technical details. Founding CEO Vinay Ravuri and other senior engineers previously worked at Qualcomm, Intel and Broadcom. EdgeQ envisions applications such as security cameras, drones, and robotic machinery that need synchronized wireless communication, local compute, and precise location. The company has offices in Santa Clara, San Diego and Bangalore, India. To date EdgeQ has raised $51 million across a seed and Series A to fund continued product development and commercialization efforts.