Kandou AI designs and delivers high-performance connectivity products and interconnect IP for datacenter infrastructure, AI and consumer electronics customers. The company reports over 20 million silicon units shipped using its technology. Recent engineering milestones include tapeout of its next-generation SerDes technology and growing momentum in its retimer product lines. Kandou AI has expanded its global engineering footprint with a new design center in Hyderabad, India, and has added industry veterans to its executive team. With the $225M Series A, the company plans manufacturing ramp-up for its AI connectivity chips and to accelerate its chip and IP portfolio. The company is led by Co-Founder and CEO Srujan Linga and is headquartered in Saint-Sulpice, Switzerland.

Total raised

$504M

Funding rounds

9

Latest round

Series A

Latest activity

Mar 2026