Lace has developed a lithography approach that uses a helium atom beam roughly 0.1 nanometer wide to pattern semiconductor features at near-atomic resolution. The company says its method could enable chip features about 10 times smaller than current light-based lithography, potentially expanding the roadmap for advanced AI chips. Lace has built prototype systems and presented its research at a scientific lithography summit. The firm aims to have a test tool operating in a pilot fab around 2029 as it advances development. Lace is Bergen-headquartered and is backed by Microsoft through its venture arm M12. The company declined to disclose its valuation while raising capital, most recently a $40 million Series A led by Atomico with several strategic investors.

Total raised

$40M

Funding rounds

1

Latest round

Series A

Latest activity

Mar 2026