Participated · Equity · Jul 2026

TYLsemi provides a reusable, standards-based chiplet portfolio—TYL.IO (connectivity), TYL.Power (in-package power delivery), and a planned TYL.Mem family—plus a full-stack TYL.Forge service for custom XPU and fabric designs. The company emphasizes UCIe-based die-to-die connectivity and integration with foundry and packaging partners to accelerate multi-die AI system development. TYLsemi emerged from stealth and raised $43 million in early-stage funding to accelerate product development and commercial engagement. It is partnering with TSMC to deliver IO and power chiplet samples to qualified customers in 2027 and is already engaging lead customers and tier-1 customer engagements that the company says validate its readiness. The firm is expanding its teams across silicon design, packaging, and systems engineering to support market deployment.

Participated · Series A · Sep 2022

Calumino is a deep-tech company that develops and manufactures proprietary, mass-deployable thermal sensors paired with AI. Its intelligent sensing platform aggregates data on human presence, activity, hazards, and the environment. The sensor can map environments, assets, and individuals and detect presence, activity, posture, differentiate humans from animals, and identify hotspots, fires, water leaks, and other anomalies. Target applications include smart building management, pest control, safety and security, healthcare, and more. The company says this data enables energy savings, operational efficiencies, improved security and safety, better quality of life, and potentially saving lives. Calumino is led by CEO Marek Steffanson and is headquartered in Australia with clients, partners, and teams globally.

Participated · Series B · Dec 2020

AIStorm is a pioneer of AI-in-Sensor processing that accepts charge directly from sensors (pixels or MEMS microphones) and performs charge-domain analog computation to run convolutional neural networks at the sensor. Its charge-switched analog approach multiplies charge directly, enabling MAC efficiencies up to several thousand TOPS per watt and minimizing the need for external components. The technology targets ultra-low-power, ultra-low-latency always-on edge use cases across imaging and audio, including facial recognition, access control, behavioral tracking, people counting, object tracking, and segmentation. AIStorm positions its solution for battery-operated devices such as cell phones, TV remotes, laptops, home security, and authentication systems. To accelerate commercialization and market access, AIStorm has strategic partnerships with AsusTek, Egis Technology, Knowles Corporation, and Meyer Corporation. The company is headquartered in Houston, Texas, with offices in Graz, Budapest and Hsinchu. AIStorm is a pioneer in high-performance AI-in-sensor processing that operates on sensor data in its native analog form to avoid digitization. Its approach enables real-time edge processing, reducing latency and power consumption while claiming five- to ten-fold cost savings versus GPUs. The technology targets applications where fast reaction and low power are critical, with explicit relevance to advanced driver-assistance systems and mobile devices. Company executives say the architecture allows intelligent pruning of sensor data streams in real time, keeping up with massive sensor inputs. AIStorm is headquartered in Silicon Valley with offices in Phoenix and Graz, Austria, and its team includes industry veterans from leading semiconductor firms. The company recently closed a $13.2 million Series A to accelerate engineering and go-to-market efforts.