Founded in 2021, Israel-based RAAAM Memory Technologies has created GCRAM, an on-chip memory architecture that offers higher density and lower power consumption than conventional SRAM while remaining compatible with standard CMOS processes. The company has already demonstrated GCRAM on silicon and is collaborating closely with strategic partner NXP Semiconductors to bring the technology into mass production. With its ability to improve memory scalability for AI and other advanced semiconductor applications, RAAAM addresses a critical pain point for chip designers. The firm plans to use newly raised capital to qualify and scale GCRAM across leading process nodes in multiple top-tier foundries and to deepen customer engagements. Including a prior EIC Accelerator grant, RAAAM has secured over $24 million to date. Headquarters are in Israel, with an R&D center in Switzerland, underscoring its multinational footprint. The company is positioning itself to transition from proven prototypes to high-volume, market-ready deployments in the near term.

Total raised

$27M

Funding rounds

4

Latest round

Series A

Latest activity

Nov 2025